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1

The flip-chip bump interconnection for millimeter-wave GaAs MMIC

Kusamitsu, H., Morishita, Y., Maruhasi, K., Ito, M., Ohata, K.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

1999

Language:

english

File:

PDF, 376 KB

english, 1999

2

British Industrialization and Design Before the Great Exhibition

Kusamitsu, Toshio

Journal:

Textile History

Year:

1981

Language:

english

File:

PDF, 3.94 MB

english, 1981

3

Great Exhibitions before 1851

Kusamitsu, Toshio

Journal:

History Workshop Journal

Year:

1980

Language:

english

File:

PDF, 1.67 MB

english, 1980

4

Great Exhibitions before 1851

Toshio Kusamitsu

Journal:

History Workshop

Year:

1980

Language:

english

File:

PDF, 2.83 MB

english, 1980

5

[IEEE 2007 Asia and South Pacific Design Automation Conference - Yokohama, Japan (2007.01.23-2007.01.26)] 2007 Asia and South Pacific Design Automation Conference - Preferable Improvements and Changes to FB-DiMM High-Speed Channel for 9.6Gbps Operation

Hiraishi, Atsushi, Sugano, Toshio, Kusamitsu, Hideki

Year:

2007

Language:

english

File:

PDF, 321 KB

english, 2007

6

[IEEE 2010 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2010.02.7-2010.02.11)] 2010 IEEE International Solid-State Circuits Conference - (ISSCC) - Capacitively coupled non-contact probing circuits for membrane-based wafer-level simultaneous testing

Daito, Mutsuo, Nakata, Yoshiro, Sasaki, Satoshi, Gomyo, Hiroyuki, Kusamitsu, Hideki, Komoto, Yoshio, Iizuka, Kunihiko, Ikeuchi, Katsuyuki, Kim, Gil Su, Takamiya, Makoto, Sakurai, Takayasu

Year:

2010

Language:

english

File:

PDF, 4.18 MB

english, 2010

7

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Evaluation of a module based memory system with an LCP flex interconnect

Kollipara, Ravi, Ming Li,, Mullen, Don, Beyene, Wendemagegnehu, Madden, Chris, Yuan, Chuck, Hideki Kusamitsu,, Toshiyasu Ito,

Year:

2009

Language:

english

File:

PDF, 598 KB

english, 2009

8

[IEEE 2008 IEEE Asian Solid-State Circuits Conference (A-SSCC) - Fukuoka, Japan (2008.11.3-2008.11.5)] 2008 IEEE Asian Solid-State Circuits Conference - 500Mbps, 670μW/pin capacitively coupled receiver with self reset scheme for wireless connectors

Katsuyuki Ikeuchi,, Kenichi Inagaki,, Hideki Kusamitsu,, Toshiyasu Ito,, Makoto Takamiya,, Sakurai, Takayasu

Year:

2008

Language:

english

File:

PDF, 3.69 MB

english, 2008

9

[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Design and testing of a high speed module based memory system

Kollipara, Ravi, Li, Ming, Mullen, Don, Beyene, Wendemagegnehu, Madden, Chris, Yuan, Chuck, Kusamitsu, Hideki, Ito, Toshiyasu

Year:

2009

Language:

english

File:

PDF, 413 KB

english, 2009

10

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Evaluation of high density liquid crystal polymer based flex interconnect for supporting greater than 1 TB/s of memory bandwidth

Kollipara, Ravi, Ming Li,, Chuck Yuan,, Kusamitsu, Hideki, Toshiyasu Ito,

Year:

2008

Language:

english

File:

PDF, 2.03 MB

english, 2008

11

[IEEE 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192) - Baltimore, MD, USA (7-12 June 1998)] 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192) - RF performance of a 77 GHz monolithic CPW amplifier with flip-chip interconnections

Maruhashi, K., Ito, M., Kusamitsu, H., Morishita, Y., Ohata, K.

Year:

1998

Language:

english

File:

PDF, 367 KB

english, 1998

12

Hankow: Commerce and Society in a Chinese City, 1796-1889by William T. Rowe

Review by: Toshio Kusamitsu

Journal:

The Economic History Review

Year:

1985

Language:

english

File:

PDF, 433 KB

english, 1985

13

Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing

Daito, M., Nakata, Y., Sasaki, S., Gomyo, H., Kusamitsu, H., Komoto, Y., Iizuka, K., Ikeuchi, K., Gil Su Kim, Takamiya, M., Sakurai, T.

Journal:

IEEE Journal of Solid-State Circuits

Year:

2011

Language:

english

File:

PDF, 2.62 MB

english, 2011

14

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - The flip-chip bump interconnection for millimeter-wave GaAs MMIC

Kusamitsu, H., Morishita, Y., Maruhashi, K., Ito, M., Ohata, K.

Year:

1998

Language:

english

File:

PDF, 513 KB

english, 1998

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